Preparation and Thermal-Physical Properties of Three Dimensional Bicontinuous SiC/Cu-Si Composite

Kuo Zhang; Hong Yan Xia; Bo Wang; Zhong Qi Shi; Xiang Zhao Zhang; Gui Wu Liu; Guan Jun Qiao

doi:10.4028/www.scientific.net/MSF.804.187

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HomeMaterials Science ForumMaterials Science Forum Vol. 804Preparation and Thermal-Physical Properties of...

Preparation and Thermal-Physical Properties of Three Dimensional Bicontinuous SiC/Cu-Si Composite

Abstract:

A three dimensional (3D) SiC/Cu-Si composite with bicontinuous structure was fabricated by spontaneous infiltration method, using porous recrystallized SiC ceramic with porosity of 37% as 3D network reinforcement and Cu alloy (Cu-18Si) as matrix. The phase composition, microstructure, and thermo-physical properties of the as-prepared 3D-SiC/Cu-Si composite were investigated. The experimental results showed that the Cu-18Si alloy could fully penetrate into the porous SiC ceramic at 1600 °C for 2 h spontaneously. SiC and Cu₁₅Si₄ phases were identified in the as-prepared composites. The interfacial bond between SiC and Cu-Si alloy was tightly and no severe interfacial reaction was observed. The thermal conductivity and coefficient of thermal expansion of the as-prepared 3D-SiC/Cu-Si composite were changed from 89.8 to 55 W·m^-1·K^-1 and 7.512 to 9.64×10^-6 °C^-1 with the temperature increased from room temperature to 500 °C, respectively.

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Periodical:

Materials Science Forum (Volume 804)

Pages:

187-190

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.804.187

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Online since:

October 2014

Authors:

Kuo Zhang, Hong Yan Xia, Bo Wang, Zhong Qi Shi*, Xiang Zhao Zhang, Gui Wu Liu, Guan Jun Qiao

Keywords:

Interpenetrating Structure, SiC/Cu Composite, Spontaneous Infiltration, Thermal Physical Property

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References

[1] X.H. QU: Prog. Nat. Sci., Vol. 21, (2011), p.189.

Google Scholar

[2] L. Zhang, X.H. Qu, X.B. He, B.H. Duan, S.B. Ren, M.L. Qin: Mater. Sci. Eng., A, 489, (2008), p.285.

Google Scholar

[3] K.M. Shu, G. C. Tu: Mater. Sci. Eng., A, 349, (2003), p.236.

Google Scholar

[4] L.Z. Zhao, M.J. Zhao, X.M. Cao, C. Tian, W.P. Hu, J.S. Zhang: Compos. Sci. Technol, Vol. 67, (2007), p.3404.

Google Scholar

[5] G. Roudini, R. Tavangar, L. Weber, A. Mortense: Int. J. Mat. Res, Vol. 101 (9), (2010), p.1113.

Google Scholar

[6] X.D. Liu, J.S. Zhang, X.M. Cao, H. Zhang: Proc. Inst. Mech. Eng. Part B J. Eng. Manuf, Vol. 219, (2005), p.111.

Google Scholar

[7] J.H. Eom, Y.W. Kim, S. Raju: J. Asian Ceram. Soc, Vol. 38, (2013), p.1.

Google Scholar

[8] O. Dezellus, F. Hodaj, C. Rado, J.N. Barbier, N. Eustathopoulos: Acta Mater, Vol. 50, (2002), P. 979.

DOI: 10.1016/s1359-6454(01)00397-4

Google Scholar

[9] J. Narciso, L. Weber, J. M. Molina, A. Mortensen, E. Louis: Mater. Sci. Technol, Vol. 22 (12), (2006), p.1464.

Google Scholar

[10] L. Zhang, X.H. Qu, X.B. He, B.H. Duan, S.B. Ren, M.L. Qin: Powder Metall, Vol. 51 (1), (2008), p.53.

Google Scholar