Effect of Silicon Addition and Thermal History on the Thermal Expansion Behavior of SiC/Al Composites

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Abstract:

Two Al-Si alloys (Al-12Si and Al-20Si) and an industrial pure Al were reinforced with 70vol.% dual-sized SiC particles. The composites experienced annealing treatment, to investigate the effect of silicon addition and thermal history on the thermal expansion behavior of high SiC content aluminum matrix composites. The results showed that silicon additions led to a beneficial reduction in the coefficients of thermal expansion (CTEs) of the composites. In the temperature range between 20°C and 400°C, a continuous increase in CTEs with temperature was observed for SiCp/pure Al composite. However, the CTEs of SiCp/Al-12Si and SiCp/Al-20Si showed the maxima at 350°Cand 250°C respectively, then diminished at higher temperatures. This was related to the change of solid solubility of silicon in aluminum at elevated temperatures. The thermal expansion behavior of SiCp/Al composites was also influenced by thermal history. After annealing treatment, the CTEs were reduced when compared with those of as-cast composites. Annealing treatment reduced the original thermal residual stresses, and then altered thermal expansion behavior of the composites.

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Periodical:

Materials Science Forum (Volumes 546-549)

Pages:

649-652

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Online since:

May 2007

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[1] H. S. Lee, C. S. Lee and J. R. Lee: Aluminum Transactions Vol. 3 (2000), pp.1-6.

Google Scholar

[2] M. Robins: Electronic Packaging and Production Vol. 40 (2000), pp.50-59.

Google Scholar

[3] C. Zweben: JOM Vol. 50 (1998), pp.47-51.

Google Scholar

[4] J. Barrett: Microelectronics Reliability Vol. 38 (1998), pp.1277-1286.

Google Scholar

[5] S. W. Lai and D. D. Chung: Journal of Material Science Vol. 24 (1994), pp.6181-6198.

Google Scholar

[6] L. F. Mondolfo: Aluminum alloys: structure and properties (The Butterworth Group, London 1976, pp.368-376).

Google Scholar

[7] M. E. Smagorinski and P. G. Tsantrizos: Mater. Sci. Technol. Vol. 16 (2000), pp.853-861.

Google Scholar

[8] T. A. Hahn and R. W. Armstrong: Int. J. Thermophys. Vol. 9 (1988), pp.179-193.

Google Scholar

[9] G. Neite and S. Mielke: Mater. Sci. Eng. A Vol. 148A (1991), pp.85-92.

Google Scholar

[10] C. B. Berry: Journal of Applied Physics Vol. 24 (1953), p.658.

Google Scholar

[11] Y. L. Shen, A. Needleman and S. Suresh. Metall. Mater. Trans. Vol. 25A (1994), pp.839-850.

Google Scholar