Abstract
TiNiSn, ZrNiSn and HfNiSn are members of a large group of intermetallic compounds which crystallize in the cubic MgAgAs-type structure. Polycrystalline samples of these compounds have been prepared and investigated for their thermoelectric properties. With thermopowers of about −200 µV/K and resistivities of a few mΩcm, power factors S2/p as high as 38 ΩW/K2 cm were obtained at 700 K. These remarkably high power factors are, however, accompanied by a thermal conductivity which is too high for applications. In order to reduce the parasitic lattice thermal conductivity, solid solutions Zrl−xHfxNiSn, Zrl−xTixNiSn, and Hfl−xTixNiSn were formed. The figure of merit of Zr0.5Hf0.5NiSn at 700 K (ZT = 0.41) exceeds the end members ZrNiSn (ZT = 0.26) and HfNiSn (ZT = 0.22).
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Acknowledgement
We would like to thank Teledyne Wah Chang (Albany, OR) for generously providing us with high purity titanium, zirconium and hafnium crystal bars.
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Hohl, H., Ramirez, A.P., Kaefer, W. et al. A New Class of Materials with Promising Thermoelectric Properties: MNiSn (M = Ti, Zr, Hf). MRS Online Proceedings Library 478, 109–114 (1997). https://doi.org/10.1557/PROC-478-109
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DOI: https://doi.org/10.1557/PROC-478-109