Weakening of an aluminum grain boundary induced by sulfur segregation: A first-principles computational tensile test

Ying Zhang, Guang-Hong Lu, Shenghua Deng, Tianmin Wang, Huibin Xu, Masanori Kohyama, and Ryoichi Yamamoto
Phys. Rev. B 75, 174101 – Published 4 May 2007

Abstract

We have performed a first-principles computational tensile test on an aluminum grain boundary (GB) with sulfur segregation. We show that the tensile strength is reduced by 18% (to 7.80GPa) due to sulfur segregation in comparison with 9.50GPa of the clean GB, and the GB fracture is caused by the interfacial bond breaking. We demonstrate the peculiar behavior of a sulfur-aluminum atom cluster at the interface during the tensile test, which originates from the intrinsic bonding characteristic of sulfur. Such cluster forms a one-dimensional chain structure that is similar to that in the bulk S, and remains unchanged in the tensile process until the fracture occurs but significantly changes the GB structure. This is responsible for the observed fact that the segregated sulfur atom bonds strongly with only a few of its neighboring aluminum atoms, leading to weaker interfacial aluminum-sulfur bonds. We suggest that the experimentally observed aluminum intergranular embrittlement is induced by the GB weakening due to sulfur segregation.

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  • Received 25 August 2006

DOI:https://doi.org/10.1103/PhysRevB.75.174101

©2007 American Physical Society

Authors & Affiliations

Ying Zhang, Guang-Hong Lu*, Shenghua Deng, and Tianmin Wang

  • Department of Physics, School of Science, Beijing University of Aeronautics and Astronautics, Beijing 100083, China

Huibin Xu

  • School of Materials Science and Engineering, Beijing University of Aeronautics and Astronautics, Beijing 100083, China

Masanori Kohyama

  • Research Institute for Ubiquitous Energy Devices, National Institute of Advanced Industrial Science and Technology, Osaka 563-8577, Japan

Ryoichi Yamamoto

  • Institute of Industrial Science, University of Tokyo, Tokyo 153-8505, Japan

  • *Electronic address: LGH@buaa.edu.cn

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Issue

Vol. 75, Iss. 17 — 1 May 2007

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