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Development of an Electrodeposited Nanomold from Compositionally Modulated Alloys

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Abstract

Electrodeposited multilayers of NiCu/Cu and NiFeCu/Cu were examined for nanoimprinting applications. Layer sizes on the order of 100 nm were deposited and the copper layer etched. Current efficiency and layer composition of electrolytes having different pH values were examined utilizing a rotating disk electrode. Due to large grain growth in the NiCu/Cu system, the bilayers resulted in a macroscopic waviness of the layers. Adding Fe in a small concentration successfully produced straight layers. As an example of the replication technique, the metal multilayer-etched stamp was used to cast the multilayer image in rubber and emboss it in Teflon®.

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Authors and Affiliations

  1. Gordon and Mary Cain Department of Chemical Engineering, Louisiana State University, Baton Rouge, LA, 70803, USA

    Che-Yih Lim, Q. Huang & E.J. Podlaha

  2. Geology Department, Louisiana State University, Baton Rouge, LA, USA

    X. Xie & S.A. Harfenist

  3. ElectroOptics Research Institute, University of Louisville, Louisville, KY, USA

    A. Safir & R. Cohn

Authors
  1. Che-Yih Lim
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  2. Q. Huang
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  3. X. Xie
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  4. A. Safir
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  5. S.A. Harfenist
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  6. R. Cohn
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  7. E.J. Podlaha
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Lim, CY., Huang, Q., Xie, X. et al. Development of an Electrodeposited Nanomold from Compositionally Modulated Alloys. Journal of Applied Electrochemistry 34, 857–866 (2004). https://doi.org/10.1023/B:JACH.0000035605.46239.6c

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  • DOI: https://doi.org/10.1023/B:JACH.0000035605.46239.6c

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