Surface Science LettersNon-linear analysis of the morphological evolution of void surfaces in metallic thin films under surface electromigration conditions
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Acknowledgements
The authors acknowledge fruitful discussions with H.S. Ho and S.J. Zhou. This work was supported by the National Science Foundation (ECS-95-01111) through a CAREER Award to DM and by the Frontiers of Materials Science Program of the UCSB Materials Research Laboratory and Los Alamos National Laboratory (STB-UC:97-63).
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