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Selective interfacial bonding and thermal conductivity of diamond/Cu-alloy composites prepared by HPHT technique

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Abstract

Cu-based and Cu-alloy-based diamond composites were made by high-pressure-high-temperature (HPHT) sintering with the aim of maximizing the thermal conductivity of the composites. Improvements in interfacial bonding strength and thermo-physical properties of the composites were achieved using an atomized copper alloy with minor additions of Co, Cr, B, and Ti. The thermal conductivity (TC) obtained exhibited as high as 688 W·m−1·K−1, but also as low as 325 W·m−1·K−1. A large variation in TC can be rationalized by the discrepancy of diamond-matrix interfacial bonding. It was found from fractography that preferential bonding between diamond and the Cu-alloy matrix occurred only on the diamond {100} faces. EDS analysis and Raman spectra suggested that selective interfacial bonding may be attributed to amorphous carbon increasing the wettability between diamond and the Cu-alloy matrix. Amorphous carbon was found to significantly affect the TC of the composite by interface modification.

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References

  1. C. Zweben, Thermal materials solve power electronics challenges, Power Electron. Technol., 40(2006), p.40.

    Google Scholar 

  2. H. Chen, C.C. Jia, K. Chu, X.B. Liang, Z.F. Liu, and H. Guo, Research on increasing thermal conductivity of diamond/copper composites by improving interface condition, Powder Metall. Technol., 28(2010), No.2, p.143.

    Google Scholar 

  3. T. Schubert, Ł. Ciupiński, W. Zieliński, A. Michalski, T. Weiβgärber, and B. Kieback, Interfacial characterization of Cu/diamond composites prepared by powder metallurgy for heat sink applications, Scripta Mater., 58(2008), No.4, p.263.

    Article  Google Scholar 

  4. T. Schubert, B. Trindade, T. Weiβgärber, and B. Kieback, Interfacial design of Cu-based composites prepared by powder metallurgy for heat sink applications, Mater. Sci. Eng. A, 475(2008), No.1–2, p.39.

    Article  Google Scholar 

  5. L. Weber and R. Tavangar, On the influence of active element content on the thermal conductivity and thermal expansion of Cu-X (X=Cr, B) diamond composites, Scripta Mater., 57(2007), No.11, p.988.

    Article  Google Scholar 

  6. Y. Xia, Y.Q. Song, C.G. Lin, S. Cui, and Z.Z. Fang, Effect of carbide formers on microstructure and thermal conductivity of diamond-Cu composites for heat sink materials, Trans. Nonferrous Met. Soc. China, 19(2009), No.5, p.1161.

    Article  Google Scholar 

  7. F.Z. Yin, H. Guo, X.M. Zhang, Y.M. Fan, and Y.Z. Zhang, Effect of Ti on microstructure and properties of diamond/copper composites, Acta Mater. Compos. Sin., 27(2010), No.3, p.138.

    Google Scholar 

  8. Y. Wang, D.C. Alsmeyer, and R.L. McCreery, Raman spectroscopy of carbon materials: structural basis of observed spectra, Chem. Mater., 2(1990), No.5, p.557.

    Article  Google Scholar 

  9. J. Robertson and E.P. O’Reilly, Electronic and atomic structure of amorphous carbon, Phys. Rev. B, 35(1987), No.6, p.2946.

    Article  Google Scholar 

  10. D.P.H. Hasselman and L.F. Johnson, Effective thermal conductivity of composites with interfacial thermal barrier resistance, J. Compos. Mater., 21(1987), No.6, p.508.

    Article  Google Scholar 

  11. K. Chu, Z.F. Liu, C.C. Jia, H. Chen, X.B. Liang, W.J. Gao, W.H. Tian, and H. Guo, Thermal conductivity of SPS consolidated Cu/diamond composites with Cr-coated diamond particles, J. Alloys Compd., 490(2009), No.1–2, p.453.

    Google Scholar 

  12. P.W. Ruch, O. Beffort, S. Kleiner, L. Weber, and P.J. Uggowitzer, Selective interfacial bonding in Al(Si)-diamond composites and its effect on thermal conductivity, Compos. Sci. Technol., 66(2006), p.2677.

    Article  Google Scholar 

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Authors and Affiliations

  1. School of Materials Science and Engineering, University of Science and Technology Beijing, Beijing, 100083, China

    Hui Chen, Cheng-chang Jia, Xian Jia & Xia Yang

  2. Shenzhen Haimingrun Industrial Co. Ltd., Shenzhen, 518126, China

    Shang-jie Li

Authors
  1. Hui Chen
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  2. Cheng-chang Jia
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  3. Shang-jie Li
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  4. Xian Jia
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  5. Xia Yang
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Correspondence to Xia Yang.

Additional information

[This work was financially supported by the National Natural Science Foundation of China (No.50971020) and the National High-Tech Research and Development Program of China (No.2008AA03Z505).]

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Chen, H., Jia, Cc., Li, Sj. et al. Selective interfacial bonding and thermal conductivity of diamond/Cu-alloy composites prepared by HPHT technique. Int J Miner Metall Mater 19, 364–371 (2012). https://doi.org/10.1007/s12613-012-0565-7

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  • DOI: https://doi.org/10.1007/s12613-012-0565-7

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