Abstract
In this research work, we have varied several parameters of a carbon nanotube based tunneling field effect transistor (CNT-TFET) such as the dielectric constant of the gate insulator (κ), channel length, oxide thickness, doping level, and the nature of doping to investigate how the performance of the CNT-TFET is affected. The performance analysis has been done based on the following performance criteria: Subthreshold swing (SS), threshold voltage (VT), and on-current to off-current ratio (Ion/Ioff). In addition, we have also analyzed how linearity and distortion figures of merit such as second-order voltage intercept point (VIP2), third-order voltage intercept point (VIP3), third-order input intercept point (IIP3), and third-order intermodulation distortion (IMD3) are affected by parametric variation. By observing the impact of parametric variation on this large number of performance metrics, a compromise choice of structural parameters is possible depending on the application. Moreover, we have proposed an asymmetric doping design that suppresses the highly undesirable ambipolar behavior in CNT-TFET. In a real-space approach, the simulation study has been carried out using the elegant non-equilibrium Green’s function (NEGF) formalism considering tight-binding Hamiltonian.
Similar content being viewed by others
References
G. Crupi, D.M.P. Schreurs, J.P. Raskin, and A. Caddemi, Solid. State. Electron. 80, 81 (2013).
A. Chaudhry and M.J. Kumar, IEEE Trans. Device Mater. Reliab. 4, 99 (2004).
M. Akram and B. Ghosh, J. Semicond. 35, 074001 (2014).
D. Kato, Y. Kajiwara, A. Mukai, H. Ono, A. Shindome, J. Tajima, T. Hikosaka, M. Kuraguchi, and S. Nunoue, Jpn. J. Appl. Phys. 59, SGGD13 (2020).
D. Madadi and A.A. Orouji, ECS J. Solid State Sci. Technol. 9, 045002 (2020).
A. Pal and A. Sarkar, Eng. Sci. Technol. an Int. J. 17, 205 (2014).
Y. Khatami and K. Banerjee, IEEE Trans. Electron Devices 56, 2752 (2009).
S. Gupta, K. Nigam, S. Pandey, D. Sharma, and P.N. Kondekar, IEEE Trans. Electron Devices 64, 4731 (2017).
A.C. Seabaugh and Q. Zhang, Proc. IEEE 98, 2095 (2010).
S. Shirazi, G. Karimi, and S. Mirzakuchaki, IEEE Trans. Electron Devices 66, 2822 (2019).
S.M. Boby, R. Islam, in 2018 4th International Conference on Electrical Engineering and Information & Communication Technology (iCEEiCT) (IEEE, 2018), pp. 449–453.
N. Balamurugan, G.L. Priya, S. Manikandan, G. Srimathi, in 2016 29th International Conference on VLSI Design and 2016 15th International Conference on Embedded Systems (VLSID) (IEEE, 2016), pp. 294–299.
A.M. Hammam, M.E. Schmidt, M. Muruganathan, S. Suzuki, and H. Mizuta, Carbon 126, 588 (2018).
J.K. Mamidala, R. Vishnoi, and P. Pandey, Tunnel Field-Effect Transistors (TFET) (London: Wiley, 2016).
S. Ahmad, N. Alam, and M. Hasan, AEU-Int. J. Electron. Commun. 89, 70 (2018).
J.H. Kim, S. Kim, and B.G. Park, IEEE Trans. Electron Devices 66, 1656 (2019).
W. Wang, Y. Sun, H. Wang, H. Xu, M. Xu, S. Jiang, and G. Yue, Semicond. Sci. Technol. 31, 035002 (2016).
P. Avouris, Z. Chen, V. Perebeinos, in Nanoscience and Technology: A Collection of Reviews from Nature Journals (World Scientific, 2010), pp. 174–184.
S.J. Tans, A.R. Verschueren, and C. Dekker, Nature 393, 49 (1998).
R. Martel, T. Schmidt, H. Shea, T. Hertel, and P. Avouris, Appl. Phys. Lett. 73, 2447 (1998).
A. Pirkle, J. Chan, A. Venugopal, D. Hinojos, C. Magnuson, S. McDonnell, L. Colombo, E. Vogel, R. Ruoff, and R. Wallace, Appl. Phys. Lett. 99, 122108 (2011).
S. Kumar, N. Peltekis, K. Lee, H.Y. Kim, and G.S. Duesberg, Nanoscale Res. Lett. 6, 390 (2011).
Q. Cao, S. Han, G.S. Tulevski, Y. Zhu, D.D. Lu, and W. Haensch, Nat. Nanotechnol. 8, 180 (2013).
X. Qin, F. Peng, F. Yang, X. He, H. Huang, D. Luo, J. Yang, S. Wang, H. Liu, L. Peng, and Y. Li, Nano Lett. 14, 512 (2014).
G.S. Tulevski, A.D. Franklin, D. Frank, J.M. Lobez, Q. Cao, H. Park, A. Afzali, S.J. Han, J.B. Hannon, and W. Haensch, ACS Nano 8, 8730 (2014).
S. Bala and M. Khosla, J. Semicond. 39, 044001 (2018).
S.O. Koswatta, D.E. Nikonov, M.S. Lundstrom, in IEEE International Electron Devices Meeting, 2005. IEDM Technical Digest. (IEEE, 2005), pp. 518–521.
S.O. Koswatta, S.J. Koester, W. Haensch, in 2009 IEEE International Electron Devices Meeting (IEDM) (IEEE, 2009), pp. 1–4.
K. Tamersit, IEEE Trans. Electron Devices 67, 704 (2020).
S.K. Sinha, S. Chaudhury, in 2012 National Conference on Computing and Communication Systems (IEEE, 2012), pp. 1–5.
Z. Xiao, J. Elike, A. Reynolds, R. Moten, and X. Zhao, Microelectron. Eng. 164, 123 (2016).
A.J. Mackus, N.F. Thissen, J.J. Mulders, P.H. Trompenaars, Z. Chen, W.M. Kessels, and A.A. Bol, Appl. Phys. Lett. 110, 013101 (2017).
A.D. Franklin, M. Luisier, S.J. Han, G. Tulevski, C.M. Breslin, L. Gignac, M.S. Lundstrom, and W. Haensch, Nano Lett. 12, 758 (2012).
S. Maas, in 2017 IEEE MTT-S International Microwave Symposium (IMS) (IEEE, 2017), pp. 87–90.
Nano tcad vides. http://vides.nanotcad.com.
G. Fiori, G. Iannaccone, and G. Klimeck, IEEE Trans. Electron Devices 53, 1782 (2006).
G. Fiori, G. Iannaccone, and G. Klimeck, IEEE Trans. Nanotechnol. 6, 475 (2007).
Y. Goswami, B. Ghosh, and P.K. Asthana, RSC Adv. 4, 10761 (2014).
S. Manikandan and N. Balamurugan, J. Comput. Electron. 19, 613 (2020).
J. Madan and R. Chaujar, IEEE Trans. Device Mater. Reliab. 16, 227 (2016).
R. Chaujar, R. Kaur, M. Saxena, M. Gupta, and R. Gupta, Superlattices Microstruct. 44, 143 (2008).
Y. Pratap, S. Haldar, R. Gupta, and M. Gupta, IEEE Trans. Device Mater. Reliab. 14, 418 (2014).
S.K. Gupta, A.S. Rawat, Y.K. Verma, and V. Mishra, Silicon 11, 257 (2019).
J.M. Guo, C. Li, Z.R. Yan, H.F. Jiang, and Y.Q. Zhuang, Micro. Nano Lett. 14, 1140 (2019).
S. Shekhar, J. Madan, and R. Chaujar, Appl. Phys. A 124, 739 (2018).
S. Wind, J. Appenzeller, R. Martel, V. Derycke, and P. Avouris, Appl. Phys. Lett. 80, 3817 (2002).
A.D. Franklin, S.O. Koswatta, D. Farmer, G.S. Tulevski, J.T. Smith, H. Miyazoe, W. Haensch, in 2012 International Electron Devices Meeting (IEEE, 2012), pp. 4–5.
M.S. Sarker, M.M. Islam, M.N.K. Alam, and M.R. Islam, Results Phys. 6, 879 (2016).
K. Boucart and A.M. Ionescu, Solid. State. Electron. 51, 1500 (2007).
P. Bal, M. Akram, P. Mondal, and B. Ghosh, J. Comput. Electron. 12, 782 (2013).
A. Kumari, S. Rani, and B. Singh, J. Electron. Mater. 48, 3078 (2019).
S.Z. Ahmed, M.S. Shawkat, M.I.H. Chowdhury, S.M. Mominuzzaman, in 10th IEEE International Conference on Nano/Micro Engineered and Molecular Systems (IEEE, 2015), pp. 388–390.
T. Joshi, B. Singh, and Y. Singh, J. Comput. Electron. 19, 658 (2020).
Author information
Authors and Affiliations
Corresponding author
Ethics declarations
Conflict of Interest
The authors declare that they have no conflict of interest.
Additional information
Publisher's Note
Springer Nature remains neutral with regard to jurisdictional claims in published maps and institutional affiliations.
Rights and permissions
About this article
Cite this article
Hussain, S., Mustakim, N. & Saha, J.K. Linearity Performance and Distortion Analysis of Carbon Nanotube Tunneling FET. J. Electron. Mater. 50, 1496–1505 (2021). https://doi.org/10.1007/s11664-020-08707-5
Received:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1007/s11664-020-08707-5