Abstract
In this work, we have studied the preparation and characterization of a new family of thermosets based on off-stoichiometric diacid-epoxy formulations in the presence of 1-methylimidazole as initiator. Tri-glycidyl para-amino phenol has been used as epoxy resin and isophthalic (AIFT), and terephthalic (ATFT) acids have been used as diacids. The curing has been analyzed isothermally at different temperatures by calorimetry, using an isoconversional method and the Šestak–Berggren equation to determine the activation energy, the frequency factor, and the reaction orders. The thermal–mechanical properties of the partially cured and fully cured materials were also determined by means of differential scanning calorimetry (DSC) and dynamic mechanical analysis (DMA). The analysis of the isothermal curing by infrared spectroscopy by Fourier transform allowed monitoring the reacting groups during the process. Two peaks appeared during the isothermal curing in the DSC. The first one is associated with the reaction of the carboxylic groups of the diacids with the epoxy groups, and the second one is related to the homopolymerization of the excess of epoxy groups. ATFT reacts less with the epoxy groups than AIFT, but accelerates more the homopolymerization and the isothermal curing ends earlier than in the systems with AIFT. Incomplete solubilization of the diacid monomers led to incomplete carboxylic reaction and excess of epoxy homopolymerization. In addition, two phases could be observed.
Similar content being viewed by others
References
Riew CK, Siebert AR, Smith RW, Fernando M, Kinloch AJ. Toughened epoxy resins: performed particles as tougheners for adhesives and matrices. In: Riew CK, Kinloch AJ, editors. Toughened plastics II novel approaches in science and engineering. Advances in chemical series, vol 252. Washington: American Chemical Society; 1996. pp. 33–44.
Saiki N, Yamazaki O, Ebe K. UV/heat dual-curable adhesive tapes for fabricating stacked packages of semiconductors. J Appl Polym Sci. 2008;108:1178–83.
Kang BU. Interfacial fracture behavior of epoxy adhesives for electronic components. J Korea Acad Ind Cooper Soc. 2011;12:1479–87.
May CA, Tanaka GY. Epoxy resins. In: May CA, editor. Chemistry and technology, Chap 1. New York: Marcel Dekker; 1988.
Petrie EM. Epoxy adhesive formulations. New York: McGraw-Hill; 2006.
Pascault JP, Williams RJJ. Epoxy polymers: new materials and innovations. Weinheim: Wiley-VCH; 2010.
Kinloch AJ, Shaw SJ, Tod DA, Hunston DL. Deformation and fracture behavior of a rubber-toughened epoxy: 1. Microstructure fracture studies. Polymer. 1983;24:1341–54.
Ho T-H, Wang C-S. Toughening of epoxy resins by modification with dispersed acrylate rubber for electronic packaging. J Appl Polym Sci. 1993;50:477–83.
Mezzenga R, Boogh L, Månson JAE. A review of dendritic hyperbranched polymer as modifiers in epoxy composites. Compos Sci Technol. 2001;61:787–95.
Guo QP, Habrard A, Park Y, Halley PJ, Simon GP. Phase separation, porous structure, and cure kinetics in aliphatic epoxy resin containing hyperbranched polyester. J Polym Sci B. 2006;44:889–99.
Ratna D, Varley R, Simon GP. Toughening of trifunctional epoxy using an epoxy-functionalized hyperbranched polymer. J Appl Polym Sci. 2003;89:2339–45.
He S, Shi K, Bai J, Zhang Z, Li L, Du Z, Zhang B. Studies on the properties of epoxy resins modified with chain-extended ureas. Polymer. 2001;42:9641–7.
Zhou L, Zhang G, Li J, Jing Z, Qin J, Feng Y. The flame retardancy and thermal stability properties of flame-retarded epoxy resins based on α-hydroxyphosphonate cyclotriphosphazene. J Therm Anal Calorim. 2017;129:1667–78.
Mao W, Li S, Yang X, Cao S, Li M, Huang K, Xia J. Preparation of a flame-retardant epoxy curing agent based on castor oil and study on the curing reaction kinetics. J Therm Anal Calorim. 2017;130:2113–21.
Evans D, Canfer SJ. Radiation stable, low viscosity impregnating resin systems for cryogenic applications. Adv Cryog Eng. 2000;46:361–8.
Ueki T, Nishijima S, Izumi Y. Designing of epoxy resin systems for cryogenic use. Cryogenics. 2005;45:141–8.
Nishijima S, Honda Y, Okada T. Application of the positron annihilation method for evaluation of organic materials for cryogenic use. Cryogenics. 1995;35:779–81.
Pascault JP, Sautereau H, Verdu J, Williams RJJ. Thermosetting polymers. 1st ed. New York: Marcel Dekker, Inc.; 2002.
Thanki JD, Parsania PH. Dynamic DSC curing kinetics and thermogravimetric study of epoxy resin of 9,9′-bis-(4-hydroxyphenyl)anthrone-10. J Therm Anal Calorim. 2017;130:2145–56.
Mustata F, Tudorachi N. Thermal behavior of epoxy resin cured with aromatic dicarboxylic acids. J Therm Anal Calorim. 2016;125:97–110.
Puig J, Hoppe CE, Fasce LA, Pérez CJ, Piñeiro-Redondo Y, Bañobre-López M, López-Quintela MA, Rivas J, Williams RJJ. Superparamagnetic nanocomposites based on the dispersion of oleic acid-stabilized magnetite nanoparticles in a diglycidylether of bisphenol A-based epoxy matrix: magnetic hyperthermia and shape memory. J Phys Chem. 2012;116:13421–8.
Altuna FI, Hoppe CE, Williams RJ. Shape memory epoxy vitrimers based on DGEBA crosslinked with dicarboxylic acids and their blends with citric acid. RSC Adv. 2016;6:88647–55.
Shau M-D, Lin C-W, Yang W-H, Lin H-R. Properties of cyclic phosphine oxide epoxy cured by diacids and anhydride. J Appl Polym Sci. 2002;84:950–61.
Zeng R-T, Wu Y, Li Y-D, Wang M, Zeng J-B. Curing behavior of epoxidized soybean oil with biobased dicarboxylic acids. Polym Test. 2017;57:281–7.
Li A, Li K. Pressure-sensitive adhesives based on epoxidized soybean oil and dicarboxylic acids. ACS Sustain Chem. 2014;2:2090–6.
Ding C, Shuttleworth PS, Makin S, Clark JH, Matharu AS. New insights into the curing of epoxidized linseed oil with dicarboxylic acids. Green Chem. 2015;17:4000–8.
Supanchaiyamat N, Shuttleworth PS, Hunt AJ, Clark JH, Matharu AS. Thermosetting resin based on epoxidised linseed oil and bio-derived crosslinker. Green Chem. 2012;14:1759–65.
Mustata F, Tudorachi N, Bicu I. The kinetic study and thermal characterization of epoxy resins crosslinked with amino carboxylic acids. J Anal Appl Pyrolysis. 2015;112:180–91.
Li Y, Xiao F, Moon K-S, Wong CP. Novel curing agent for lead-free electronics: amino acid. J Polym Sci Part A Polym Chem. 2006;44:1020–7.
Ramis X, Fernández-Francos X, De La Flor S, Ferrando F, Serra À. Click-based dual-curing thermosets and their applications. In: Guo Q, editor. Thermosets: structure, properties and applications, Chapter 16. 2nd ed. Amsterdam: Elsevier; 2017.
Fernández-Francos X, Konuray AO, Belmonte A, De la Flor S, Serra À, Ramis X. Sequential curing of off-stoichiometric thiol-epoxy thermosets with a custom-tailored structure. Polym Chem. 2016;7:2280–90.
Morancho JM, Ramis X, Fernández-Francos X, Salla JM, Konuray AO, Serra À. Curing of off-stoichiometric amine-epoxy thermosets. J Therm Anal Calorim. 2018;133:519–27.
Morancho JM, Ramis X, Fernández-Francos X, Salla JM, Konuray O, Serra À. Curing and thermomechanical properties of off-stoichiometric anhydride-epoxy thermosets. J Therm Anal Calorim. 2019;138:2865–72.
Vyazovkin S, Burnham AK, Criado JM, Pérez-Maqueda LA, Popescu C, Sbirrazzuoli N. ICTAC kinetics committee recommendations for performing kinetic computations on thermal analysis data. Thermochim Acta. 2011;520:1–19.
Flores M, Fernández-Francos X, Ramis X, Serra À. Novel epoxy-anhydride thermosets modified with a hyperbranched polyester as toughness enhancer. Thermochim Acta. 2012;544:17–26.
Acknowledgements
The authors would like to thank MCIU (Ministerio de Ciencia, Innovación y Universidades) and FEDER (Fondo Europeo de Desarrollo Regional) (MAT2017-82849-C2-1-R and MAT2017-82849-C2-2-R) and Generalitat de Catalunya (2017-SGR-77 and Serra Húnter program) for the financial support.
Author information
Authors and Affiliations
Corresponding author
Additional information
Publisher's Note
Springer Nature remains neutral with regard to jurisdictional claims in published maps and institutional affiliations.
Rights and permissions
About this article
Cite this article
Morancho, J.M., Ramis, X., Fernández-Francos, X. et al. Dual curing of an epoxy resin with dicarboxylic acids. J Therm Anal Calorim 142, 607–615 (2020). https://doi.org/10.1007/s10973-020-09523-z
Received:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1007/s10973-020-09523-z