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POSS-modified PEG adhesives for wound closure

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Abstract

PEG-related adhesives are limited in clinical use because they are easy to swell and cannot support the cell growth. In this study, we produced a series of POSS-modified PEG adhesives with high adhesive strength. Introduction of inorganic hydrophobic POSS units decreased the swelling of the adhesives and enhanced cell adhesion and growth. The in vitro cytotoxicity and in vivo inflammatory response experiments clearly demonstrated that the adhesives were nontoxic and possessed excellent biocompatibility. Compared with the sutured wounds, the adhesive-treated wounds showed an accelerated healing process in wounded skin model of the Bama miniature pig, demonstrating that the POSS-modified PEG adhesive is a promising candidate for wound closure.

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Author notes

  1. These authors contributed equally to this work.

Authors and Affiliations

  1. Beijing National Laboratory for Molecular Sciences, State Key Laboratory of Polymer Physics & Chemistry, Institute of Chemistry, Chinese Academy of Sciences, Beijing, 100190, China

    Ya-zhong Bu, Fei Yang & De-cheng Wu  (吴德成)

  2. University of Chinese Academy of Sciences, Beijing, 100049, China

    Ya-zhong Bu, Fei Yang & De-cheng Wu  (吴德成)

  3. Department of Orthopaedics, Chinese PLA General Hospital, Beijing, 100853, China

    Guo-fei Sun, Li-cheng Zhang, Jian-heng Liu & Pei-fu Tang  (唐佩福)

Authors
  1. Ya-zhong Bu
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  2. Guo-fei Sun
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  3. Li-cheng Zhang
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  4. Jian-heng Liu
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  5. Fei Yang
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  6. Pei-fu Tang  (唐佩福)
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  7. De-cheng Wu  (吴德成)
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Corresponding authors

Correspondence to Pei-fu Tang  (唐佩福) or De-cheng Wu  (吴德成).

Additional information

This work was financially supported by the National Natural Science Foundation of China (Nos. 21674120, 81630056 and 21474115), PLA (No. AWS14C003) and “Young Thousand Talents Program”.

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Bu, Yz., Sun, Gf., Zhang, Lc. et al. POSS-modified PEG adhesives for wound closure. Chin J Polym Sci 35, 1231–1242 (2017). https://doi.org/10.1007/s10118-017-1958-x

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  • DOI: https://doi.org/10.1007/s10118-017-1958-x

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