Abstract
The presence of impurities like Mg2+, Mn2+, Zn2+, and Al3+ during electrowinning of nickel shows several effects. The effects include current efficiency, deposit quality, purity, crystallographic orientation, surface morphology, and polarization behavior. Addition of the impurities did not change the current efficiency significantly but did change the quality and purity of the electrodeposited nickel. Based on the quality of the deposits obtained, the tolerance limits of these impurities in nickel bath were obtained. Although no deviation of nickel structure from fee was observed, the peak height values for different orientations changed with all of the impurities and the values varied with impurity concentration. The surface morphologies of electrodeposited nickel in the presence of impurities also showed changes. The potentiodynamic scan curves for nickel deposition showed deviations in the presence of all the impurities studied. Based on the results, an attempt was made to correlate the various effects.
Similar content being viewed by others
References
O.A. Esin and E. Alfimova:Trans. Electrochem. Soc, 1935, vol. 68, 8 pp. (preprint).
O.A. Esin and M. Laskarev:J. Phys. Chem., USSR, 1939, vol. 13, pp. 186–93.
V. A. Yuza and L. D. Kopyl:J. Phys. Chem., USSR, 1940, vol. 14, pp. 1074–84.
F. Sait:Disc. Faraday Soc, 1947, no. 1, pp. 169–81.
G.E. Gardam:Disc. Faraday Soc, 1947, no. 1, pp. 182–90.
A. T. Vagramyan and Z. A. Soloveva:Dok. Akad. Nauk. USSR, 1950, vol. 77, pp. 629–31.
H.J. Reiser and H. Fischer:Z. Elektrochem., 1954, vol. 58, pp. 668–72.
S.V. Gorbachev and Yu. N. Yurkevich:J. Chem. Phys. USSR, 1954, vol. 28, pp. 1120–28.
H. Fischer, M. Seipt, and G. Marlock:Z. Elektrochem., 1955, vol. 59, pp. 440–48.
L. Yang:J. Electrochem. Soc, 1950, vol. 97(8), pp. 241–44.
J. Yeager, J. P. Cels, E. Yeager, and F. Hovorka:J. Electrochem. Soc, 1959, vol. 106(4), pp. 328–36.
H. Jr. Leidheiser and A.T. Gwathmey:J. Electrochem. Soc, 1951, vol. 98, pp. 225–30.
M.R.J. Wyllie:J. Chem. Phys., 1948, vol. 16, pp. 52–64.
A. Brenner, V. Zentner, and C. W. Jennings:Plating, 1952, vol. 39, pp. 865–927.
D. J. Evans:Trans. Faraday Soc, 1958, vol. 54, pp. 1086–91.
D. R. Cliffe and J. P. G. Farr:J. Electrochem. Soc, 1964, vol. Ill, pp. 299–306.
N. A. Pangarov:Electrochim. Acta, 1964, vol. 9, pp. 721–26.
I. Epelboin, M. Froment, and G. Maurin:Plating, 1969, vol. 56, pp. 1356–62.
A.D.NReddy:J. Electroanal. Chem., 1973, vol. 6, pp. 141, 153, 159.
M.A. Zhamagortsyan, Z. N. Pilikyan, A.A. Yavich, and A.T. Vagramyan:Electrokhimiya, 1975, vol. 11(3), pp. 437–40.
J. Amblard: Thesis, Paris, CNRS A.O. 12387, 1976.
J. Amblard, M. Froment, and N. Spyrellis:Surf. Technol., 1977, vol. 5, pp. 205–34.
J. Amblard, I. Epelboin, M. Froment, and G. Maurin:J. Appl. Electrochem., 1979, vol. 9, pp. 233–42.
S. Nakahara and E. C. Felder:J. Electrochem. Soc, 1982, vol. 129(1), pp. 45–49.
A. Vertes, I. Czako. Nagy, and L. Lakatos-Varasenyl:J. Electrochem. Soc, 1984, vol. 131(7), pp. 1526–31.
D.J. MacNaughtan and A.W. Hothersall:Trans. Faraday Soc, 1935, vol. 31, p. 1168.
E. Liebreich:Trans. Faraday Soc, 1935, vol. 31, p. 213.
W.A. Wood:Trans. Faraday Soc, 1935, vol. 31, pp. 1248–53.
L. S. Palatnik:Trans. Faraday Soc, 1936, vol. 32, p. 939.
A.W. Hothersall and G. E. Gardam:J. Electrodepositor’s Tech. Soc, 1939, vol. 15, pp. 127–40.
H. Fischer and H. Barmann:Z. Metallkunde, 1940, vol. 32, pp. 376–83.
W. Hume-Rothery and M.R.J. Wyllie:Proc. Roy. Soc. London, 1943, vol. A181, pp. 331–44.
W. Smith, J.H. Keeler, and H.J. Read:Plating, 1949, vol. 36, pp. 355–61.
G.L. Clark and S.H. Simonsen:J. Electrochem. Soc, 1951, vol. 98, pp. 110–15.
R. Well and R. Paquin:J. Electrochem. Soc, 1960, vol. 107(2), pp. 87–91.
M. R. Thomson:Trans. Am. Electrochem. Soc, 1922, vol. 42, p. 79.
M.R. Thomson and C.T. Thomas:Trans. Am. Electrochem. Soc, 1922, vol. 42, preprint, CA. 1922, vol. 16, p. 4144.
M.R. Thomson:Trans. Am. Electrochem. Soc, 1923, vol. 43, p. 359.
L. M. Evalannikov and D.S. Neiman:Trans. Leningrad Ind. Inst., 1939, No. 1, Sect. Met. No. 1, pp. 3–23.
M. B. Diggin:Monthly Rev. Am. Electroplateds Soc, 1946, vol. 33, pp. 513–24.
C. Quattrone:Galvanotecnica, 1952, vol. 3, pp. 105–14.
D.T. Ewing, A.A. Brouwer, and J.K. Werner:Plating, 1952, vol. 39, pp. 1343–49.
B.C. Banerjee and A. Goswami:J. Electrochem. Soc, 1959, vol. 106(1), pp. 590–92.
A. Ganeidy, W. A. Kochler, and W. Machu:J. Electrochem. Soc, 1959, vol. 106, pp. 394–403.
J. K. Dennis and J. J. Fuggles:Trans. Inst. Met. Fin., 1968, vol. 46, pp. 185–93.
Modern Electroplating, F. A. Lowenheim, ed., Wiley-Interscience Pub., New York, NY, pp. 39, 325.
L. C. Singh, V. B. Singh, and P. K. Tikoo:J. Electrochem. Soc, Ind., 1979, vol. 28, pp. 87–88.
W. G. Sherwood, P. B. Queneau, C. Nikolic, and D.R. Hodges:Metall. Trans. B, 1979, vol. 10B, pp. 659–66.
D. J. Mackinnon, J. M. Brannen, and R. M. Manison: 1982, vol. 12, pp. 39–53.
D.J. Mackinnon and J.M. Brannen:J. Appl. Electrochem., 1977, vol. 7(5), pp. 451–59.
D.J. Mackinnon and J.M. Brannen:J. Appl. Electrochem., 1979, vol. 9, p. 71.
B.K. Thomas and D.J. Fray:J. Appl. Electrochem., 1981, vol. 11(6), pp. 677–83.
Author information
Authors and Affiliations
Rights and permissions
About this article
Cite this article
Gogia, S.K., Das, S.C. The effects of Mg2+, Mn2+, Zn2+, and Al3+ on the nickel deposit during electrowinning from sulfate bath. Metall Trans B 19, 823–830 (1988). https://doi.org/10.1007/BF02651406
Received:
Issue Date:
DOI: https://doi.org/10.1007/BF02651406