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Brazing of pressureless-sintered SiC using Ag-Cu-Ti alloy

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Abstract

A pressureless-sintered SiC was brazed to itself using Ag-Cu alloy foil to which titanium had been added. The results obtained revealed the following. (i) Increasing the titanium addition to the base metal from 2 to 8 wt % improved the wettability greatly, but the bonding generally became weaker. (ii) With 2 wt % Ti addition, a reaction layer about 1 μm thick was formed, regardless of which brazing temperature was used, while bond strength reached was over linearly with temperature. The maximum room-temperature bend strength reached was over 350 MPa. (iii) In the case of the alloy with only 2 wt % Ti additive, bonding was greatly influenced not only by improvement of the wettability at high temperatures and longer holding times, but also the composition and thickness of the resultant reaction layer.

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Authors and Affiliations

  1. Tokyo Institute of Technology, Research Laboratory for Nuclear Reactors, O-okayama, Meguro-Ku, 152, Tokyo, Japan

    Jonas Kofi Boadi, Toyohiko Yang & Takayoshi Iseki

Authors
  1. Jonas Kofi Boadi
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  2. Toyohiko Yang
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  3. Takayoshi Iseki
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Boadi, J.K., Yang, T. & Iseki, T. Brazing of pressureless-sintered SiC using Ag-Cu-Ti alloy. J Mater Sci 22, 2431–2434 (1987). https://doi.org/10.1007/BF01082127

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  • DOI: https://doi.org/10.1007/BF01082127

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