Abstract
A relation is derived between the mismatch strain, the film thickness, and the displacement of a linear elastic structure under external loading during material deposition. If any two of these variables can be experimentally determined, then the remaining variable can be determined. The method allows one to experimentally determine the mismatch strain by measuring the film thickness and the displacement of a point on the structure that is not undergoing deposition. The intrinsic stresses can be used to self-assemble microstructures during material deposition. Assembly of two components is considered: one component is subjected to deposition and is modeled as an Euler-Bernoulli beam, and the other component is not subjected to deposition and is modeled as a linear spring. For the purposes of this paper, the definition of assembly requires that the beam do work on the spring. The analysis is experimentally verified by electroplating nickel onto an AFM cantilever beam in contact with a second AFM beam (serving as the spring) that does not undergo deposition.
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This paper was recommended for publication in revised form by Associate Editor Maenghyo Cho
Sang-Hyun Kim obtained his B. S. (1993) and M.S. (1995) degrees in Aerospace Engineering from Pusan Nation University and Ph.D. (2005) in Aerospace Engineering from Texas A&M University. After getting Ph.D., he joined Micro Systems Lab. at Samsung Advanced Institute of Technology (SAIT) and worked in the field of MEMS designs, especially microsensors, microactuator and inkjet print head. He is currently working as a faculty member in Mechanical Systems Engineering at Hansung University. His research interest lies in design, fabrication and test of MEMS/NEMS. He is also interested in the development of design platform of multi-physics and multiscale phenomena.
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Kim, SH., Boyd, J.G. Intrinsic stress, mismatch strain, and self-assembly during deposition of thin films subjected to an externally applied force. J Mech Sci Technol 22, 2048–2055 (2008). https://doi.org/10.1007/s12206-008-0806-x
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DOI: https://doi.org/10.1007/s12206-008-0806-x