Abstract
Two types of self-assembled monolayers (SAMs), dicarboxylic acid and dithiol, were used to treat the silver nanoparticles. Thermogravimetric analyzer (TGA), differential scanning calorimeter (DSC), and contact angle results indicated that the SAMs were well coated on the silver nanoparticles and thermally stable below 150°C. By introducing the monolayer-coated silver nanoparticles into the anisotropic conductive adhesives (ACAs), the electrical properties and thermal conductivity of ACAs were significantly improved. The joint resistance of the ACA decreased from 10−3 Ohm to 10−5 Ohm with SAMs-coated silver fillers, and the current carrying capability of ACAs was also obviously improved. The improved electrical properties are due to the stronger bonding between nanofillers and the SAM coating materials; consequently, this improved the ACA interfacial properties. The enhanced interfacial properties with the SAM-protected nanofillers also attributed to the improved thermal conductivity of ACAs.
Similar content being viewed by others
References
J. Lau, C.P. Wong, N.C. Lee, and S.W.R. Lee, Electronics Manufacturing: with Lead-Free, Halogen-Free, and Conductive-Adhesive Materials (New York: McGraw Hill, 2002), ch. 11.
Environment-Friendly Electronics: Lead-Free Technology, ed. J.S. Hwang (Port Erin, Isle of Man, British Isles: Electrochemical Publications Ltd., 2001), pp. 64–67.
M. Abet and G. Selvaduray, Mater. Sci. Eng. 27, 95 (2000).
Handbook of Lead-Free Solder Technology for Microelectronic Assemblies, ed. Karl J. Puttlitz and Kathleen A. Stalter (New York: Marcel Dekker, Inc., 2004), pp. 49–113.
Y. Li, K. Moon, and C.P. Wong, Science 308, 1419 (2005).
Conductive Adhesives for Electronics Packaging, ed. J. Liu (Isle of Man, British Isles: Electrochemical Publications, Ltd., 1999), pp. 1–16.
D.J. Small, B. Eisenach, A. Lewis, and A. Babiarz, Adv. Packaging Jan., 38 (1999).
Yi Li and C.P. Wong, Polytronic 2004 4th Int. IEEE Conf. on Polymers and Adhesives in Microelectronics and Photonics (Piscataway, NJ: IEEE, 2004), pp. 1–7.
K. Gilleo, Soldering Surf. Mount Technol. 19, 12 (1995).
P.G. Harris, Soldering Surf. Mount Technol. 20, 19 (1995).
A.O. Ogunjimi, O. Boyle, D.C Whalley, and D.J. Williams, J. Electron. Manufacturing 2, 109 (1992).
C.P. Wong, K. Moon, and Y. Rao (Paper presented at the NSF Design, Service and Manufacturing Grantees and Research Conf., Birmingham, AL, 2003).
C.P. Wong, K. Moon, and Y. Li, “Introduction of Self Assembled Monolayer in Electrically Conductive Adhesive Joints to Enhance Electrical Current Carrying Capability and Electrical Stability,” U.S. Patent pending.
Y. Li, K. Moon, and C.P. Wong, J. Electron. Mater. 34, 266 (2005).
M. Yim, J. Hwang, J. Kim, H. Kim, W. Kwon, K.W. Jang, and K.W. Paik, Proc. 54th IEEE Electronic Components and Technology Conf. (Las Vegas, NV, 2004), pp. 159–164.
Author information
Authors and Affiliations
Rights and permissions
About this article
Cite this article
Li, Y., Moon, KS. & Wong, C.P. Monolayer-protected silver nano-particle-based anisotropic conductive adhesives: Enhancement of electrical and thermal properties. J. Electron. Mater. 34, 1573–1578 (2005). https://doi.org/10.1007/s11664-005-0167-5
Received:
Accepted:
Issue Date:
DOI: https://doi.org/10.1007/s11664-005-0167-5