Abstract
The purpose of this study was to investigate the influence of Cu-coating on the spreading kinetics and equilibrium contact angles of aluminum on ceramics using a sessile drop technique. Al2O3 and SiC plates were coated by electroless plating. The copper film overcomes the low wetting of the uncoated samples by dissolution in the drop at 800 °C in argon, showing an intrinsically favorable effect on the adhesion energy. Just after 2 min, the contact angle decreased to 12.6° and 26°for Al/Cu–Al2O3 and Al/Cu–SiC, respectively. However, a de-wetting behavior was observed, reaching equilibrium contact angles of 58.3° and 45.5° for the couples. The dissolution reaction rate at the triple junction was so high that the spreading process was controlled by local diffusion rather than chemical reaction kinetics.
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Acknowledgments
The authors would like to thank NSERC (Canada) and CONACYT (Mexico) for financially supporting this research through various grants and scholarships.
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León, C.A., Mendoza-Suarez, G. & Drew, R.A.L. Wettability and spreading kinetics of molten aluminum on copper-coated ceramics. J Mater Sci 41, 5081–5087 (2006). https://doi.org/10.1007/s10853-006-0443-7
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DOI: https://doi.org/10.1007/s10853-006-0443-7