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Micromechanical characterization of electroplated permalloy films for MEMS

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Abstract

In order to improve the reliability of MEMS designs, evaluating the mechanical properties of soft magnetic materials is needed. In this paper, we present a tensile testing method to characterize the mechanical properties of microscale electroplated permalloy (80 wt% Ni, 20 wt% Fe) films. The gauge section of the specimen is 50 μm wide, 100 μm long and 5 μm thick. The measured Young’s modulus of permalloy films is 96.4 GPa, and the tensile strength is 1.61 GPa. The fracture strain measured by the images of specimens is about 2%.

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Acknowledgments

The authors are grateful for the financial support from the China Postdoctoral Science Foundation and acknowledge the cooperation from Sato Lab, Nagoya University.

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Authors and Affiliations

  1. Key Laboratory for Thin Film and Microfabrication Technology of Ministry of Education, Institute of Micro/Nano Science and Technology, Shanghai Jiao Tong University, 1954 Huashan Road, Shanghai, 200030, China

    Xueping Li & Guifu Ding

  2. Department of Micro-Nano Systems Engineering, Nagoya University, Furo-cho, Chikusa-ku, Nagoya, 464-8603, Japan

    Taeko Ando, Mitsuhiro Shikida & Kazuo Sato

Authors
  1. Xueping Li
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  2. Guifu Ding
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  3. Taeko Ando
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  4. Mitsuhiro Shikida
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  5. Kazuo Sato
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Correspondence to Xueping Li.

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Li, X., Ding, G., Ando, T. et al. Micromechanical characterization of electroplated permalloy films for MEMS. Microsyst Technol 14, 131–134 (2008). https://doi.org/10.1007/s00542-007-0408-z

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  • DOI: https://doi.org/10.1007/s00542-007-0408-z

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