Abstract
We prepare Cu/Ni bilayer films by depositing the incident atoms on Cu substrates with various surface orientations and under different temperatures and investigate interfacial structure, surface roughness, radial distribution function and hardness of the films. We find that the incident atoms can penetrate (001) substrate more easily than other surfaces, resulting in a transitional layer consisting of two kinds of atoms. Stacking faults are generated in the bilayer films deposited on the (111) substrate, which can reduce misfit strain and thus account for the layer growth mode of the films. The surface roughness decreases with the increase in deposition temperature. Moreover, we also find that a certain degree of roughness benefits the formation of coherent interface due to the tilted-layer epitaxial growth. The hardness differs for the films deposited at different temperatures.
Similar content being viewed by others
References
R.C. Cammarata, T.E. Schlesinger, C. Kim, S.B. Qadri, A.S. Edelstein, Appl. Phys. Lett. 56, 1862 (1990)
F.L. Shan, Z.M. Gao, Y.M. Wang, Thin Solid Films 324, 162–164 (1998)
H.C. Barshilia, K.S. Rajam, Surf. Coat. Technol. 155, 195–202 (2002)
S.K. Ghosh, P.K. Limaye, B.P. Swain, N.L. Soni, R.G. Agrawal, R.O. Dusane, A.K. Grover, Surf. Coat. Technol. 201, 4609–4618 (2007)
X.Y. Zhu, X.J. Liu, R.L. Zong, F. Zeng, F. Pan, Mater. Sci. Eng. A 527, 1243–1248 (2010)
C.T. Wang, S.R. Jian, J.S.C. Jang, Y.S. Lai, P.F. Yang, Appl. Surf. Sci. 255, 3240–3250 (2008)
T. Li, T. Liu, H. Wei, S. Hussain, J. Wang, W. Zeng, X. Peng, Z. Wang, Appl. Surf. Sci. 355, 1132–1135 (2015)
R.S. Dutta, A. Arya, C. Yusufali, B. Vishwanadh, R. Tewari, G.K. Dey, Surf. Coat. Technol. 235, 741–747 (2013)
B. Alling, A. Karimi, I.A. Abrikosov, Surf. Coat. Technol. 203, 883–886 (2008)
T. Fu, X. Peng, Y. Zhao, C. Feng, S. Tang, N. Hu, Z. Wang, Phys. E 69, 224–231 (2015)
T. Fu, X. Peng, C. Huang, D. Yin, Q. Li, Z. Wang, Appl. Surf. Sci. 357, 643–650 (2015)
T. Fu, X. Peng, Y. Zhao, R. Sun, S. Weng, C. Feng, Z. Wang, Ceram. Int. 41, 14078–14086 (2015)
T. Fu, X. Peng, Y. Zhao, R. Sun, D. Yin, N. Hu, Z. Wang, RSC Adv. 5, 77831–77838 (2015)
T. Fu, X. Peng, C. Feng, Y. Zhao, Z. Wang, Appl. Surf. Sci. 356, 651–658 (2015)
V. Dupont, F. Sansoz, J. Mater. Res. 24, 948–956 (2011)
W.-Y. Chang, T.-H. Fang, S.-J. Lin, J.-J. Huang, Mol. Simul. 36, 815–822 (2010)
C. Begau, A. Hartmaier, E.P. George, G.M. Pharr, Acta Mater. 59, 934–942 (2011)
D. Saraev, R. Miller, Acta Mater. 54, 33–45 (2006)
M. Imran, F. Hussain, M. Rashid, S.A. Ahmad, Chin. Phys. B 21, 126802 (2012)
M.C. Benoudia, F. Gao, J.M. Roussel, S. Labat, M. Gailhanou, O. Thomas, D.L. Beke, Z. Erdélyi, G. Langer, A. Csik, M. Kis-Varga, Phys. Rev. B 85, 235404 (2012)
G.J. Tucker, S.M. Foiles, Mater. Sci. Eng., A 571, 207–214 (2013)
S.-F. Hwang, Y.-H. Li, Z.-H. Hong, Comput. Mater. Sci. 56, 85–94 (2012)
J. Zhang, C. Liu, J. Fan, Appl. Surf. Sci. 276, 417–423 (2013)
Z.-H. Hong, S.-F. Hwang, T.-H. Fang, Comput. Mater. Sci. 41, 70–77 (2007)
S.-J. Lin, C.-D. Wu, T.-H. Fang, G.-H. Chen, Appl. Surf. Sci. 258, 5892–5897 (2012)
M.S. Daw, M.I. Baskes, Phys. Rev. Lett. 50, 1285–1288 (1983)
M.S. Daw, M.I. Baskes, Phys. Rev. B 29, 6443–6453 (1984)
X.W. Zhou, R.A. Johnson, H.N.G. Wadley, Phys. Rev. B 69, 144113 (2004)
S. Shao, S.N. Medyanik, Mech. Res. Commun. 37, 315–319 (2010)
S. Shao, H.M. Zbib, I. Mastorakos, D.F. Bahr, J. Eng. Mater. Technol. 135, 021001 (2013)
X.W. Zhou, H.N.G. Wadley, J. Appl. Phys. 87, 553 (2000)
S.-G. Lee, Y.-C. Chung, Appl. Surf. Sci. 253, 8896–8900 (2007)
T. Zientarski, D. Chocyk, Thin Solid Films 562, 347–352 (2014)
T. Schneider, E. Stoll, Phys. Rev. B 17, 1302–1322 (1978)
T. Zientarski, D. Chocyk, Appl. Surf. Sci. 306, 56–59 (2014)
Z.-H. Hong, S.-F. Hwang, T.-H. Fang, J. Appl. Phys. 103, 124313 (2008)
F.C. Nix, D. MacNair, Phys. Rev. 60, 597–605 (1941)
M. Ohring, Chapter 7—substrate surfaces and thin-film nucleation, in Materials Science of Thin Films, 2nd edn., ed. by M. Ohring (Academic Press, San Diego, 2002), pp. 357–415
G.J. Ackland, A.P. Jones, Phys. Rev. B 73, 054104 (2006)
A. Stukowski, Modell. Simul. Mater. Sci. Eng. 20, 045021 (2012)
F. Riesz, Vacuum 46, 1021–1023 (1995)
Acknowledgments
The authors acknowledge the financial supports from the National Natural Science Foundation of China (Grant nos. 11332013, 11272364), the Scientific Research (B) (Grant no. 15H04114), the Challenging Exploratory Research (Grant no. 15K14117), the JSPS and CAS under Japan–China Scientific Cooperation Program, the Shorai Foundation for Science and Technology, and the Chongqing Research Program of Basic Research and Frontier Technology (Grant no. cstc2015jcyjA50008).
Author information
Authors and Affiliations
Corresponding authors
Rights and permissions
About this article
Cite this article
Fu, T., Peng, X., Zhao, Y. et al. MD simulation of effect of crystal orientations and substrate temperature on growth of Cu/Ni bilayer films. Appl. Phys. A 122, 67 (2016). https://doi.org/10.1007/s00339-015-9592-3
Received:
Accepted:
Published:
DOI: https://doi.org/10.1007/s00339-015-9592-3