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Unimolecular and Supramolecular Electronics I pp 239–273Cite as

Issues and Challenges in Vapor-Deposited Top Metal Contacts for Molecule-Based Electronic Devices

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Part of the book series: Topics in Current Chemistry ((TOPCURRCHEM,volume 312))

Abstract

Metal vapor deposition to form ohmic contacts is commonly used in the fabrication of organic electronic devices because of significant manufacturability advantages. In the case of single molecular layer devices, however, the extremely small thickness, typically ~1–2nm, presents serious challenges in achieving good contacts and device integrity. This review focuses on recent scientific aspects of metal vapor deposition on monolayer thickness molecular films, particularly self-assembled monolayers, ranging across mechanisms of metal nucleation, metal-molecular group interactions and chemical reactions, diffusion of metal atoms within and through organic films, and the correlations of these and other factors with device function. Results for both non-reactive and reactive metal deposition are reviewed. Finally, novel strategies are considered which show promise for providing highly reliable and durable metal/organic top contacts for use in metal–molecule–metal junctions for device applications.

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Notes

  1. 1.

    Our preliminary cp-AFM results of Au thermal deposition on octanedithiol SAM under UHV condition at room temperature and 10 K revealed short-circuit filament generation.

  2. 2.

    Our preliminary AFM observation of Pb thermal deposition on hexadecanedithiol SAM on Au/mica under UHV condition at room temperature revealed continuous penetration of Pb as unpublished results.

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Authors and Affiliations

  1. Department of Applied Chemistry, Tokyo Institute of Technology, Tokyo, 152-8552, Japan

    Masato M. Maitani

  2. Department of Chemistry, Pennsylvania State University, University Park, PA, 16802, USA

    David L. Allara

  3. Department of Materials Science and Engineering, Pennsylvania State University, University Park, PA, 16802, USA

    David L. Allara

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  1. Masato M. Maitani
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  2. David L. Allara
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Correspondence to David L. Allara .

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  1. , Department of Chemistry, The University of Alabama, Office 210A, Lloyd Hall, Tuscaloosa, 35487, USA

    Robert M. Metzger

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Maitani, M.M., Allara, D.L. (2011). Issues and Challenges in Vapor-Deposited Top Metal Contacts for Molecule-Based Electronic Devices. In: Metzger, R. (eds) Unimolecular and Supramolecular Electronics I. Topics in Current Chemistry, vol 312. Springer, Berlin, Heidelberg. https://doi.org/10.1007/128_2011_177

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